US Patent 7292055 Interposer for use with test apparatus

Patent 7292055 was granted and assigned to Endicott Interconnect Technologies, Inc. on November, 2007 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

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Endicott Interconnect Technologies, Inc.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

72920550

Patent Inventor Names

Frank D. Egitto0

How T. Lin0

Date of Patent

November 6, 2007

Patent Application Number

111109010

Date Filed

April 21, 2005

Patent Citations Received

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US Patent 12084676 Cas9 orthologs

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US Patent 11773400 Methods for producing genetic modifications in a plant genome without incorporating a selectable transgene marker, and compositions thereof

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US Patent 11935859 Chip structure and manufacturing method thereof

Patent Primary Examiner

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Minh N. Tang

Patent abstract

An interposer including at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers.