Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 6, 2007
Patent Application Number
11115253
Date Filed
April 27, 2005
Patent Primary Examiner
Patent abstract
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.
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