Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Saburo Noda0
Shinya Itani0
Masaki Yashiro0
Hiroshi Yokoyama0
Makoto Tsuji0
Date of Patent
October 30, 2007
0Patent Application Number
110919220
Date Filed
March 29, 2005
0Patent Primary Examiner
Patent abstract
To provide a mold clamping apparatus able to suppress spout of a molding material from between mating faces of dies and to extend the lifetime of the dies. A mold clamping apparatus has a control apparatus deciding a distribution of a load divided by a plurality of tie bars based on information concerning to the die and controlling pressure of driving oil of a cylinder chamber of each cylinder for mold clamping independently to become a load having a determined distribution.
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