US Patent 7282793 Multiple die stack apparatus employing T-shaped interposer elements
Patent 7282793 was granted and assigned to Micron Technology on October, 2007 by the United States Patent and Trademark Office.
All edits
Edits on 1 Sep, 2023
Golden AI
Edits made to:
Article (+273 characters)
Article
Patent abstract
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed.
Edits on 25 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07282793 Multiple die stack apparatus employing T-shaped interposer elements US Patent 7282793 Multiple die stack apparatus employing T-shaped interposer elements
Infobox
Patent Number
0728279300
Patent Number
728279300
Edits on 18 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 23 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072827930
Date of Patent
October 16, 2007
0Patent Application Number
113020050
Date Filed
December 13, 2005
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072827930
Date of Patent
October 16, 2007
0Patent Application Number
113020050
Date Filed
December 13, 2005
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 22 Nov, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07282793 Multiple die stack apparatus employing T-shaped interposer elements
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07282793
Date of patent
October 16, 2007
Patent application number
11302005
Date Filed
December 13, 2005
Patent primary examiner
Find more entities like US Patent 7282793 Multiple die stack apparatus employing T-shaped interposer elements
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.