US Patent 7282395 Method of making exposed pad ball grid array package

Patent 7282395 was granted and assigned to Freescale Semiconductor on October, 2007 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Freescale Semiconductor

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

72823950

Patent Inventor Names

Heng Keong Yip0

Date of Patent

October 16, 2007

Patent Application Number

112971030

Date Filed

December 7, 2005

Patent Primary Examiner

‌

Trung Dang

Patent abstract

A method of making an exposed-pad ball-grid array package (11) includes applying a conductive sheet (16) to an adhesive tape (18). Stamping the conductive sheet (16) to form a die pad (24) and separating the remainder (26) of the sheet from the adhesive tape (18) so that only the die pad (24) remains on the adhesive tape (18). A substrate (28) is applied to the adhesive tape (18) proximate to the die pad (24). A die (30) is attached to the die pad (24) and electrically coupled to the substrate (28). An encapsulant (34) is formed around at least a portion of the die (30), the die pad (24) and the substrate (28) above the adhesive tape (18). The adhesive tape (18) is removed from the die pad (24), substrate (28) and encapsulant (34). Conductive balls (36) are attached to the substrate (28).