US Patent 7281327 Method for manufacturing double-sided printed circuit board

Patent 7281327 was granted and assigned to Nitto Denko on October, 2007 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7281327

Date of Patent

October 16, 2007

Patent Application Number

11122369

Date Filed

May 5, 2005

Patent Primary Examiner

‌

Carl J. Arbes

Patent abstract

An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.