US Patent 7279657 Scanned rapid thermal processing with feed forward control

Patent 7279657 was granted and assigned to Applied Materials on October, 2007 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

72796570

Date of Patent

October 9, 2007

Patent Application Number

111518790

Date Filed

June 13, 2005

Patent Primary Examiner

‌

Quang Van

Patent abstract

A thermal processing system and method including scanning a line beam of intense radiation in a direction transverse to the line direction for thermally processing a wafer with a localized effectively pulsed beam of radiant energy. The thickness of the wafer is two-dimensionally mapped and the map is used to control the degree of thermal processing, for example, the intensity of radiation in the line beam to increase the uniformity. The processing may include selective etching of a pre-existing layer or depositing more material by chemical vapor deposition.