Patent attributes
The present invention relates to contacting technology for signal connections in the substrate of an extremely high frequency module, in particular a microwave or millimeter wave module. The extremely high frequency module contains a) a multilayer substrate having at least two dielectric layers and metallization layers and inter-layer connections, and b) chips positioned on the top of the multilayer substrate. The chips are electrically connected to each other and to the structures in the metallization layers by means of HF connections. The HF connection is realized by means of at least two conductor lines, which exhibit fanning. The present invention allows for simple contacting of chips having small intervals between the external contacts on the multilayer substrate.
