Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hyung-kun Kim0
Su-hee Chae0
Tae-hoon Jang0
Date of Patent
October 2, 2007
0Patent Application Number
113722040
Date Filed
March 10, 2006
0Patent Primary Examiner
Patent abstract
A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process.
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