Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 2, 2007
Patent Application Number
11440400
Date Filed
May 25, 2006
Patent Primary Examiner
Patent abstract
An acceleration sensor includes a semiconductor substrate, a sensing element formed on the semiconductor substrate, a bonding frame made of polysilicon which is formed on the semiconductor substrate and surrounds the sensing element, and a glass cap which is bonded to a top surface of the bonding frame made of polysilicon to cover the sensing element above the sensing element while being spaced by a predetermined distance from the sensing element. The bonding frame made of polysilicon is not doped with any impurity.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
