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US Patent 7262965 Thermal structure for electric devices

Patent 7262965 was granted and assigned to Shuttle Inc. on August, 2007 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Patent attributes

Current Assignee

Shuttle Inc.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

72629650

Patent Inventor Names

Jung-Hsiang Cheng0

Date of Patent

August 28, 2007

Patent Application Number

112643420

Date Filed

October 28, 2005

Patent Primary Examiner

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Jayprakash Gandhi

Patent abstract

A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is installed on the heat sink base. The fan housing is fixed on the fin module. Blades are installed inside the fan housing. The fan includes inlets on an upper surface and a lower surface of the fan housing and a outlet on a side surface of the fan housing, so as to absorb heat through the inlet and eliminate the heat through the outlet. Therefore, the heat dissipating efficiency is improved.