Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
George C. Anderson0
Jose Diaz0
Date of Patent
August 21, 2007
0Patent Application Number
112132000
Date Filed
August 25, 2005
0Patent Primary Examiner
Patent abstract
A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base board (110) to provide separate surface mountable contacts (148-158, 166) with which to independently bias each die (102, 104, 106) while the heat sink (108) provides thermal dissipation for the die. Assembly (100) provides a surface mountable package well suited to multiband applications.
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