Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 21, 2007
Patent Application Number
10867187
Date Filed
June 14, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and reprocessing. The semiconductor device holder holds each individual die in a separate processing cavity configured to hold each individual die in a predetermined processing position. In one embodiment, a vacuum force is used to hold one or more dies in respective processing cavities with a predetermined level of force even if other adjacent die processing cavities are unoccupied by other individual dies.
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