Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroyasu Jobetto0
Osamu Okada0
Date of Patent
August 14, 2007
Patent Application Number
11143293
Date Filed
June 1, 2005
Patent Primary Examiner
Patent abstract
A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.
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