Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroyuki Onishi0
Jun Ishikawa0
Koichi Akagawa0
Toshiaki Nagase0
Date of Patent
August 14, 2007
0Patent Application Number
109795630
Date Filed
November 2, 2004
0Patent Primary Examiner
Patent abstract
In a semiconductor apparatus in which a main current of a semiconductor device flows through a wiring pattern formed on an insulation circuit board, the rise in temperature of the wiring pattern is suppressed and the increase in cost of parts can be minimized. On the insulation circuit board, a copper pattern is formed. A heat spreader is soldered to the copper pattern, and the heat spreader is loaded with a semiconductor chip. An external electrode and the heat spreader are arranged to shorten the distance between the side of the external electrode and the side of the heat spreader.
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