US Patent 7253504 Integrated circuit package and method

Patent 7253504 was granted and assigned to Advanced Micro Devices on August, 2007 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Advanced Micro Devices

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7253504

Date of Patent

August 7, 2007

Patent Application Number

11010784

Date Filed

December 13, 2004

Patent Primary Examiner

‌

Alexander Oscar Williams

Patent abstract

An integrated circuit package includes a substrate having a central axis dividing the substrate into an upper half and a lower half and an integrated circuit coupled to the substrate. A layer is provided within the substrate in the lower half thereof that is configured to resist warpage of the integrated circuit package, the layer provided a distance from the central axis.