US Patent 7250673 Signal isolation in a package substrate

Patent 7250673 was granted and assigned to TriQuint Semiconductor on July, 2007 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

TriQuint Semiconductor

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7250673

Date of Patent

July 31, 2007

Patent Application Number

11146817

Date Filed

June 6, 2005

Patent Primary Examiner

‌

Ida M. Soward

Patent abstract

Signal traces are patterned on a top surface of a substrate. A ground trace is patterned on the top surface of the substrate for at least one pair of the signal traces. A die paddle is patterned on the top surface of the substrate, and the die paddle is connected directly with the ground trace.