Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 31, 2007
Patent Application Number
11073724
Date Filed
March 8, 2005
Patent Primary Examiner
Patent abstract
A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
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