Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Lloyd G. Burrell0
Toyohiro Aoki0
Wolfgang Sauter0
Date of Patent
July 31, 2007
0Patent Application Number
109065070
Date Filed
February 23, 2005
0Patent Primary Examiner
Patent abstract
A sensor for measuring cracks in a semiconductor device, such as a wafer and, more particularly, to a BEOL wirebond crack sensor for low-k dies or wafers, and a method of providing the wirebond crack sensor for low-k wafers or the like structures.
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