Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 24, 2007
Patent Application Number
10654375
Date Filed
September 3, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion pivots with respect to a first portion of the substrate.
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