Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 10, 2007
Patent Application Number
10695630
Date Filed
October 27, 2003
Patent Primary Examiner
Patent abstract
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
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