Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shinji Isokawa0
Tomoji Yamaguchi0
Date of Patent
July 10, 2007
0Patent Application Number
105068260
Date Filed
February 24, 2003
0Patent Primary Examiner
Patent abstract
A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3, a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10, and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip.
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