Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 26, 2007
Patent Application Number
10885782
Date Filed
July 8, 2004
Patent Primary Examiner
Patent abstract
A hillock-free conductive layer comprising at least two aluminum (Al) layers formed on a substrate, wherein said at least two Al layers comprise a barrier Al layer formed on the substrate, and a pure Al layer formed on the barrier Al layer. The barrier Al layer could be an aluminum nitride (AlNx) layer, an aluminum oxide (AlOx) layer, an aluminum oxide-nitride (AlOxNy) layer, or an Al—Nd alloy layer. Also, the pure Al layer is physically thicker than the barrier Al layer, for effectively inhibiting the occurrence of hillocks and the like.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.