US Patent 7235165 Electroplating solution and method for electroplating

An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate metals without the need to add plating metal ions to the solution in the form of metal salts, chelates or complexes.