US Patent 7232538 Injection molding coupling apparatus

Injection molding coupling apparatus and method is configured to be installed between a relatively movable injection unit and a relatively stationary unit base. A subplate is configured to be relatively movable with respect to the unit base, and preferably includes linear bearings for rolling on a pair of linear rails. A flexible pad device is configured to be disposed between the subplate and the injection unit. The flexible pad device is configured to minimize misalignment caused by thermal elongation of heated components and the relative movement between the injection unit and the unit base.