Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yenting Wen0
James Knapp0
Harold Anderson0
Francis Carney0
Cang Ngo0
Date of Patent
June 5, 2007
0Patent Application Number
105248940
Date Filed
September 10, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L150) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading.
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