Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 5, 2007
Patent Application Number
11145673
Date Filed
June 6, 2005
Patent Primary Examiner
Patent abstract
One embodiment of the invention is a method for evaluating a material such as low-k dielectric, by a stress-generating test tool such as a needle. The evaluation object is shaped as a stack of adhering layers: low-k dielectric, first metal (preferably copper), barrier metal (preferably tantalum nitride), and second metal (preferably aluminum). A numerical correlation is established between a cracking in the barrier metal layer caused by probing and a damage in the layer of insulating material-to-be-tested.
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