US Patent 7224047 Semiconductor device package with reduced leakage
Patent 7224047 was granted and assigned to LSI Corporation on May, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 18, 2004
Date of Patent
May 29, 2007
Patent Application Number
11015534
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 7224047 Semiconductor device package with reduced leakage
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.