US Patent 7223480 Metal laminate and etching method therefor
Patent 7223480 was granted and assigned to Mitsui Chemicals on May, 2007 by the United States Patent and Trademark Office.
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The present invention relates to a metal laminate which is broadly used for a flexible wiring board or the like and an etching method therefor. In particular, the present invention relates to a metal laminate which includes a layer obtained by laminating a metal layer and an insulating layer, where the insulating layer is subjected to an etching process, wherein, in a surface of the metal layer which is positioned so as to come in contact with the insulating layer, respective concentrations of main metal element and oxygen element constituting the metal layer are measured from the surface of the metal layer towards inside of the metal layer in a time-elapsing manner according to AES (Auger electron spectroscopy) and a value of the thickness of a metal oxide film of the surface of the metal layer measured at a time when atomic concentrations of the main metal element and the oxygen element constituting the metal layer become equal to each other is in a range of at least 0 Å to less than 50 Å.
US Patent 07223480 Metal laminate and etching method therefor US Patent 7223480 Metal laminate and etching method therefor
US Patent 07223480 Metal laminate and etching method therefor
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