Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
William R. Bandy0
Michael R. Arneson0
Date of Patent
May 29, 2007
0Patent Application Number
108661480
Date Filed
June 14, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the support structure is increased to increase a space between adjacent dies of the plurality of dies. Dies may be transferred from the expanded support structure.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
