Log in
Enquire now
‌

US Patent 7221157 Magnetic sensor apparatus and manufacturing method thereof

Patent 7221157 was granted and assigned to Denso on May, 2007 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent

Patent attributes

Current Assignee
Denso
Denso
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7221157
Date of Patent
May 22, 2007
Patent Application Number
11050672
Date Filed
February 7, 2005
Patent Primary Examiner
‌
Edward Lefkowitz
Patent abstract

Two Hall element forming arrangements are formed on a semiconductor substrate. Each Hall element forming arrangement includes a Hall element that is formed in a principal surface of the semiconductor substrate. A base is formed separately from the semiconductor substrate. Then, the base is disposed at a rear surface of the semiconductor substrate and holds the semiconductor substrate and the Hall element forming arrangements. The base includes a holding surface, which holds the semiconductor substrate, and two slant surfaces, each of which is slanted relative to the holding surface. Each Hall element forming arrangement is held on a corresponding one of the at least one slant surface of the base.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 7221157 Magnetic sensor apparatus and manufacturing method thereof

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.