US Patent 7211332 Laminate

A laminate having a metal foil layer, and a polyimide resin layer provided on the metal foil layer, wherein the polyimide resin layer is obtained by curing a coating of a polyimide resin precursor solution directly applied onto a surface of the metal foil layer, wherein the polyimide resin layer has a linear expansion coefficient in the range from 10 to 30 ppm/K, wherein the metal foil layer and the polyimide resin layer have a bonding strength therebetween of at least 0.5 kN/m in terms of 180° peel strength, and wherein the polyimide resin obtained from the polyimide resin precursor solution contains at least 50% by weight of a moiety having a structure represented by the following formula (1) shown in the specification.