Patent attributes
A pressure sensor includes a sensor chip having a pressure receiving surface formed on one surface of the sensor chip, a first case having one end portion at which the sensor chip is provided, a second case attached to the one end portion of the first case to cover the sensor chip. The second case is provided with a pressure introducing passage for introducing the pressure to the sensor chip, and a wiring board is provided at the one end portion of the first case to have a surface facing toward the pressure introducing passage. In the pressure sensor, the sensor chip is electrically connected with the surface of the wiring board through bumps by a flip-chip bonding such that the pressure receiving surface faces the surface of the wiring board, and an insulating member is provided to seal a connection portion of the bumps.
