US Patent 7207367 Method and apparatus for joining adhesive tape

Patent 7207367 was granted and assigned to Nitto Denko on April, 2007 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

72073670

Patent Inventor Names

Masayuki Yamamoto0

Date of Patent

April 24, 2007

Patent Application Number

108989960

Date Filed

July 27, 2004

Patent Primary Examiner

‌

Linda Gray

Patent abstract

In an adhesive tape joining method for joining an adhesive tape to a surface of an article, cutting out the adhesive tape along an outer peripheral edge of the article and, then, collecting the unnecessary adhesive tape which has been cut out, the unnecessary adhesive tape is wound and collected so as not to shrink at a cut portion of the adhesive tape in a width direction.