US Patent 7205233 Method for forming CoWRe alloys by electroless deposition

Patent 7205233 was granted and assigned to Applied Materials on April, 2007 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

72052330

Date of Patent

April 17, 2007

Patent Application Number

107037690

Date Filed

November 7, 2003

Patent Primary Examiner

‌

Thao P. Le

Patent abstract

A method for fabricating a capping layer with enhanced barrier resistance to both copper and oxygen diffusion, comprises forming a capping layer on a conductive surface of an interconnect, wherein the capping layer comprises cobalt (Co), tungsten (W), rhenium (Re), and at least one of phosphorus (P) and boron (B). In an embodiment of the invention, forming the capping layer comprises exposing the conductive surface to an electroless capping solution comprising a cobalt source, a tungsten source, a rhenium source, and at least one of a phosphorus source and a boron source, and annealing the capping layer.