Patent attributes
A circuit coupled to an input-output bond pad (I/O pad) in an integrated circuit including an input buffer, an output buffer and a pad management circuit. The pad management circuit receives a first data signal, a first output enable signal, and a configuration signal indicative of the connection state of the I/O pad, and generates a second data signal and a second output enable signal. When the configuration signal indicates the I/O pad is to be connected to a package pin, the pad management circuit couples the first data signal as the second data signal and couples the first output enable signal as the second output enable signal. When the configuration signal indicates the I/O pad is to be left unconnected, the pad management circuit asserts the second output enable signal and generates the second data signal having a predetermined value.
