Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Markus Naujok0
Erdem Kaltalioglu0
Date of Patent
April 10, 2007
0Patent Application Number
112731340
Date Filed
November 14, 2005
0Patent Primary Examiner
Patent abstract
Apparatus for and methods of chemical mechanical polishing (CMP) of semiconductor wafers are disclosed. A preferred embodiment comprises an apparatus for polishing a semiconductor workpiece that includes a polishing pad, a fluid dispenser adapted to dispense a fluid to the polishing pad, and a temperature measurement device adapted to measure the temperature of the fluid. The apparatus includes a heat exchanger adapted to increase or decrease the temperature of the fluid.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
