Patent attributes
A wafer boat for consolidation of a porous oxide layer structure is provided. The wafer boat includes at least one support plate including: a first plate for supporting a substrate with the porous oxide layer by face-to-face contact; a second plate radially extending from a periphery of the first plate; and a stepped portion for limiting movement of the substrate formed with a predetermined height along a border line between the first plate and the second plate. The wafer boat also includes a support plate supporting the edge of the wafer to be consolidated, so that it is possible to prevent the porous layer of a wafer located underneath from being damaged by the falling particles from the broken particles from the porous layer of the wafer located at the upper side. Also, the omission of a dummy wafer can reduce the size of the consolidation furnace, and the automation system and the process can be simplified leading to reduction of the production cost. In addition, since a stepped portion is provided for limiting movement of the wafer mounted on the wafer boat, damage to the porous layer of the wafer due to contact of the wafer with the support rod can be prevented.
