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US Patent 7192494 Method and apparatus for annealing copper films

Patent 7192494 was granted and assigned to Applied Materials on March, 2007 by the United States Patent and Trademark Office.

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Patent abstract

A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system.

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