Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 6, 2007
Patent Application Number
11186794
Date Filed
July 22, 2005
Patent Primary Examiner
Patent abstract
A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap defining a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
