US Patent 7186454 Dielectric films and materials therefor
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Patent Inventor Names
Jiichiro Hashimoto0
Kiyoharu Tsutsumi0
Shinya Nagano0
Yoshinori Funaki0
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Patent abstract
A material for dielectric films is a polymerizable composition containing an organic solvent, and an adamantanepolycarboxylic acid derivative represented by following Formula (1):
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US Patent 07186454 Dielectric films and materials therefor US Patent 7186454 Dielectric films and materials therefor
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Patent Number
071864540
Patent Number
71864540
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Official Website
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Patent Jurisdiction
Patent Number
071864540
Date of Patent
March 6, 2007
0Patent Application Number
108074260
Date Filed
March 24, 2004
0Official Website
Patent Primary Examiner
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US Patent 07186454 Dielectric films and materials therefor
Infobox
Is a
Patent jurisdiction
Patent number
07186454
Date of patent
March 6, 2007
Patent application number
10807426
Date Filed
March 24, 2004
Patent primary examiner
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