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US Patent 7186442 Constrained layer damper

Patent 7186442 was granted and assigned to Sika on March, 2007 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Current Assignee
Sika
Sika
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
71864420
Patent Inventor Names
Steven A. Rosenberg0
Norman Blank0
Philip E. Weber0
Robert D. Myers0
Cheong Kow0
Kevin Casey0
Date of Patent
March 6, 2007
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Patent Application Number
104588890
Date Filed
June 11, 2003
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Patent Primary Examiner
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William Phillip Fletcher, III
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Patent abstract

A method for installing a constrained layer damper on a product of manufacture is disclosed. The method includes applying a layer of first polymeric material to a substrate of the product, wherein the first polymeric material is visco-elastic when solidified. Then, a second layer of polymeric material, which is stiff when solidified, is applied to the first polymeric material such that said first polymeric material is constrained between the second polymeric material and the substrate of the product. At least one of the layers of polymeric materials is dispensed in fluid form during the manufacture of the product from a bulk source of fluid material. The polymeric materials are chosen such that they do not require the application of heat above room temperature to solidify.

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