US Patent 7183654 Providing a via with an increased via contact area

Patent 7183654 was granted and assigned to Intel on February, 2007 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7183654

Date of Patent

February 27, 2007

Patent Application Number

10674704

Date Filed

September 30, 2003

Patent Primary Examiner

‌

Leonardo Andujar

Patent abstract

An apparatus and method to provide a via with an increased via contact area. A semiconductor support layer is coupled to a dielectric layer and a contact is coupled to the dielectric layer. A via, having an enlarged end within the semiconductor support layer, passes through the semiconductor support layer and the dielectric layer and connects to the contact. In one embodiment, the formation of the via and the enlarged end in the semiconductor support layer are completed in a single dry etch process.