Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 20, 2007
Patent Application Number
11040334
Date Filed
January 24, 2005
Patent Primary Examiner
Patent abstract
An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.
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