Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 20, 2007
Patent Application Number
10493437
Date Filed
August 25, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body having a metal film formed on the sealing body surface. A ground pattern is formed at the outer periphery of the principal surface of the circuit board. The metal film is conductively connected with the ground pattern.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
