Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 20, 2007
Patent Application Number
10729176
Date Filed
December 4, 2003
Patent Primary Examiner
Patent abstract
Singulating a wafer into individual die using a pre-scribing technique. Embodiments of the invention relate to scribing a wafer prior to the fabrication process in order to help preserve the integrity of the fabricated devices during singulation.
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