US Patent 7177143 Molded electronic components

Techniques for making robust but precise electrical components, such as molded equalizers designed for interface with amplifiers in CATV or other communications equipment, are disclosed. An exemplary embodiment of an electrical component includes an injection-molded housing encapsulating an equalizer circuit and with pins protruding from one end. The housing and pins are designed for interface with predetermined locations in CATV amplifiers or optic nodes. The addition of the molten plastic changes the performance of the equalizer circuit, requiring pre-mold adjustments to the circuit design to be made in order for the final molded equalizer to achieve the desired operating characteristics.