US Patent 7176559 Integrated circuit package with a balanced-part structure

Patent 7176559 was granted and assigned to VIA Technologies on February, 2007 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

VIA Technologies

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

71765590

Patent Inventor Names

Moriss Kung0

Andy Liao0

Kwun Yao Ho0

Terry Ku0

Date of Patent

February 13, 2007

Patent Application Number

106370450

Date Filed

August 8, 2003

Patent Citations Received

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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing

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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate

Patent Primary Examiner

Douglas W Owens

Patent abstract

An integrated circuit package includes a balanced-part structure. The condition of thermal stress of chips connected on a substrate decides the amount, locations, weights, and the material of at least a balanced-part fastened on a substrate. The balanced-part is fastened on the substrate to balance stress distribution before an adhering heat sinks process and a packaging molding compound process. The balanced-part also decreases thermal stress affection and avoid warpage defects of the integrated circuit packages.