Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Srinivasan Sridharan0
Orville Washington Brown0
Date of Patent
February 13, 2007
Patent Application Number
10864304
Date Filed
June 9, 2004
Patent Primary Examiner
Patent abstract
Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.
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