Patent attributes
A known good die is economically fabricated. A tested integrated circuit is provided which includes a die having a bonding location on an upper surface and a lead. An upper portion of the integrated circuit package is removed or ground away to expose the bonding location. The lead is removed leaving the die and exposed bonding location to provide a known good die. The backside portion of the integrated circuit package is removed or ground away to expose the backside of the die. A contact pad is disposed on the bonding location. The bonding wire and exterior lead are also removed or ground away. The upper portion of the bonding ball is removed to provide a flattened bonding location. Preferably, the tested integrated circuit package provided is a thin small outline integrated circuit package (TSOP), and advantageously may be a packaged flash memory integrated circuit.
